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What are you searching for?
July 19, 2005
By: Greg Hrinya
RFID circuit Matrics Columbia MD USA The UHF RFID Integrated Circuit will be embedded in the next generation of smart inlays and labels. The smaller chips will be less expensive to manufacture for two reasons: more chips can be produced from each silicon wafer and the chips are produced using a standard Complementary Metal Oxide Semiconductor process, the lowest cost silicon fabrication process. 410-872-0030 fax 410-872-0070 www.matrics.com Circle No. 109
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